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Reliability of Electrodeposited Copper and ECRCVD SiOF Films for Multilevel Metallization

Author(s):
Kim, Y-A.
Kim, Y-I.
Lee, K-W.
Lee, S.
Oh, K.
Park, J-W.
Sohn, S.
Yang, S-H.
3 more
Publication title:
Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
565
Pub. Year:
1999
Page(from):
93
Page(to):
100
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558994720 [1558994726]
Language:
English
Call no.:
M23500/565
Type:
Conference Proceedings

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