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Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures

Author(s):
Publication title:
Polycrystalline metal and magnetic thin films : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
562
Pub. Year:
1999
Page(from):
235
Page(to):
242
Pages:
8
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994690 [1558994696]
Language:
English
Call no.:
M23500/562
Type:
Conference Proceedings

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