Blank Cover Image

Characterization of Plated Cu Thin Film Microstructures

Author(s):
Beyers, R. B.
Cabral, C.
Gignac, L. M.
Klepeis, S. J.
Locke, P. S.
ricacos, P. C.
Rice, P. M.
Rodbell, K. P.
3 more
Publication title:
Polycrystalline metal and magnetic thin films : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
562
Pub. Year:
1999
Page(from):
209
Page(to):
214
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994690 [1558994696]
Language:
English
Call no.:
M23500/562
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Characterization of Plated Cu Thin Film Microstructures

Gignac, L. M., Rodbell, K. P., Cabral, C., Jr., Andricacos, P. C., Rice, P. M., Beyers, R. B., Locke, P. S., Klepeis, S. …

MRS - Materials Research Society
7 Conference Proceedings Film Crystallographic Texture and Substrate Surface Roughness in Layered Aluminum Metallization

Rodbell, K. P., Svilan, V., Gignac, L. M., DeHaven, P. W., Murphy, R. J., Licata, T. J.

MRS - Materials Research Society
2 Conference Proceedings Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Cabral, C., Gignac, L., Harper, J. N. E., Hu, C. K., Noyan, I. C., ricacos, P. C., Rodbell, K. P.

Materials Research Society
8 Conference Proceedings KINETICS OF INTERMETALLIC FORMATION IN FREE STANDING Cu/Mg MULTILAYER THIN FILMS

Arcot, B., Clevenger, L. A., Murarkar, S. P., Harper, J. M. E., Cabral Jr., C.

Materials Research Society
3 Conference Proceedings Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Harper, J. M. E., Cabral, C., Jr., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K.

MRS - Materials Research Society
9 Conference Proceedings GRAIN GROWTH IN Al-(Cu, Pd, Nb) THIN FILMS

Mis, J. D., Rodbell, K. P.

MRS - Materials Research Society
4 Conference Proceedings Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep

Cohen, S. A., Liu, J., Gignac, L., Ivers, T., Armbrust, D., Rodbell, K. P., Gates, S. M.

MRS - Materials Research Society
10 Conference Proceedings CORRELATION OF THE STRESS-TEMPERATURE HISTORY WITH MICROSTRUCTURE IN Al-0.5Cu AND Al-0.15Pd THIN FILMS

Knorr, D. D., Rodbell, K. P.

MRS - Materials Research Society
5 Conference Proceedings Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep

Armbrust, D., Cohen, S. A., Gates, S. M., Gignac, L., Ivers, T., Liu, J., Rodbell, K. P.

Materials Research Society
11 Conference Proceedings THE EFFECT OF ANNEALING ON THE Cu DISTRIBUTION AND Al2Cu PRECIPITATION IN Al(Cu) THIN FILMS

Colgan, E. G., Rodbell, K. P., Vigliotti, D. R.

MRS - Materials Research Society
6 Conference Proceedings Dopants in Electroplated Copper

Andricacos, P.C., Parks, C., Cabral, C., Wachnik, R., Tsai, R., Maihotra, S., Locke, P., Fluegel, J., Horkans, J., …

Electrochemical Society
12 Conference Proceedings Dependence of Crystallographic Texture of C54 TiSi2 on Thickness and Linewidth in Submicron CMOS Structures

Svilan, V., Rodbell, K. P., Clevenger, L. A., Cabral, C., Jr., Roy, R. A., Lavoie, C., Jordan-Sweet, J., Harper, J. M. …

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12