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4 A plated through-hole interconnect technology in Silicon

Author(s):
Publication title:
Proceedings of the Second International Symposium on Electrochemical Microfabrication
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1994-32
Pub. Year:
1994
Page(from):
45
Page(to):
55
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770910 [1566770912]
Language:
English
Call no.:
E23400/950718
Type:
Conference Proceedings

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