Blank Cover Image

Particle and Process Improvements in an MERIE Dielectric Etcher

Author(s):
Publication title:
Proceedings of the tenth symposium on plasma processing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1994-20
Pub. Year:
1994
Page(from):
348
Page(to):
356
Pages:
9
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770774 [1566770777]
Language:
English
Call no.:
E23400/941901
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Wafer-cleaning process after plasma metal etch

Louis,D., Lee,W.M., Holmes,D.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Impact of thin resist processes on post-etch LER

Mahorowala, A.P., Goldfarb, D.L., Temple, K., Petrillo, K.E., Pfeiffer, D., Babich, K., Angelopoulos, M., Gallatin, …

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Optimized cobalt silicide formation through etch process improvements

Tucker, D.S., Yang, R., Maines, H.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Gate etch process control

Krogh, O., Freeland, M., Mori, R., Chowdhury, T.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings Yield improvement program using in-situ particle monitoring for particle reduction on a Semitool Magnum based on process control and process optimization

Vogels,L.J.P., Dohmen,M.W.C., Duijvenboden,P.van, Latimer,R.A., Heffernan,J.D.O.

SPIE - The International Society for Optical Engineering
9 Conference Proceedings STOCHASTIC MODELING FOR CONTROL OF A SEMICONDUCTOR ETCH PROCESS

Rhinehart, R. Russell, Wu, Feng-Shang

American Institute of Chemical Engineers
4 Conference Proceedings 300 mm Wafer Dielectric Oxide Etch Process and Tool Improvements

Poschenrieder, A., Mautz, K.

Electrochemical Society
10 Conference Proceedings PARTICLE REDUCTION IN POST-VIA ETCH PROCESS

Yang, M., Campbell, J.P.

Electrochemical Society
5 Conference Proceedings The effects of etch chemistry on the etch rates of ArF BARC prodcts [6153-23]

Zhuang, H, Abdallah, D, Xiang, Z, Wu, H, Shan, J, Lu, P H, Neisser M, Karwacki, E J, Ji, B, Badowski, P R

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Flow Field and Gas-Bubble Size Analysis in Water Model for the Process of Aluminum Melt Degassing by Particle Image Velocimetry

R.Z. Wu, D. Shu, J. Wang, B.D. Sun, M.L. Zhang

Trans Tech Publications
6 Conference Proceedings INTEGRATION OF HIGH-k GATE DIELECTRICS - WET ETCH CLEANING AND SURFACE CONDITIONING

De Gendt, S., Beckx, S., Caymax, M., Claes, M., Conard, T., Delabie, A., Deweerd, W., Hellin, D., Kraus, H., Onsia, B., …

Electrochemical Society
12 Conference Proceedings Improvement of III-N Surfaces after Inductively Coupled Plasma Dry Etch Exposure

Keogh, D.M., Dupuis, R.D., Feng, M., Raychaudhuri, S., Asbeck, P.M.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12