Investigation of defects and mechanical stresses distribution in SOI-structures formed by combined ion implantation

Investigation of defects and mechanical stresses distribution in SOI-structures formed by combined ion implantation

Author(s):

Publication title:

Proceedings of the Sixth International Symposium on Silicon-on-Insulator Technology and Devices

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

1994-11

Pub. Year:

1994

Page(from):

104

Page(to):

110

Pages:

7

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566770439 [1566770432]

Language:

English

Call no.:

E23400/941388

Type:

Conference Proceedings

Details

TDL ID:	ZA00014120
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Silicon-on-Insulator Technology and Devices ; Electrochemical Society Meeting
Conf. info. (Number):	6th ; 185th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1994.05.22-1994.05.27

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