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Electroless copper deposition on tungsten for silicon integrated circuits

Author(s):
Mak, C.Y.
Feldman, L.C.
Wong, Y-H.
Weir, B.E.
Blanco, J.
Angyal, M.
Scacham-Diamond, Y.
2 more
Publication title:
Proceedings of the Second International Symposium on Electrochemical Technology Applications in Electronics
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-20
Pub. Year:
1993
Page(from):
233
Page(to):
256
Pages:
24
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770620 [1566770629]
Language:
English
Call no.:
E23400/932472
Type:
Conference Proceedings

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