Blank Cover Image

Process-structure-property interrelationships of copper for electronic applications

Author(s):
Woodman, A.S.
Taylor, E.J.
Anderson, E.B.
Weil, R.
Hong, S.
Knapke, D.H.
Fisher, G.L.
2 more
Publication title:
Proceedings of the Second International Symposium on Electrochemical Technology Applications in Electronics
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-20
Pub. Year:
1993
Page(from):
86
Page(to):
98
Pages:
13
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770620 [1566770629]
Language:
English
Call no.:
E23400/932472
Type:
Conference Proceedings

Similar Items:

Kimble,M.C., Anderson,E.B., Jayne,K.D., Woodman,A.S., Legner,H.H.

American Institute of Aeronautics and Astronautics

I.D. Choi, S.G. Kang, J.H. Jang, S.B. Lee, M.H. Hong

Trans Tech Publications

H. McCrabb, E.J. Taylor, R. Carpio

Electrochemical Society

Carr,G.L., Lobo,R.P.S.M., Hirschmugl,C.J., LaVeigne,J., Reitze,D.H., Tanner,D.B.

SPIE-The International Society for Optical Engineering

Xhen, Z-X., Allen, J. W., Yeh, J. J., Kang, J.-S., Ellis, W., Spicer, W. E., Lindau, I., Sun, J. Z., Geballe, T. H., …

Materials Research Society

Lazzaroni. R, Logdlund. M, Stafstorm. S, Salaneck. R. W, Bradley. C.D.D, Friend. H. R, Sato. N, Orti. E, Bredas. L.J

Kluwer Academic Publishers

Kiefl,R.F., Brewer,J.H., Kreitzman,S.R., Lnke,G.M., Riseman,T.M., Estle,T.L., Celio,M., Ansaldo,E.J.

Trans Tech Publications

Mintmire, J.W., Robertson, D.H., Dunlap, B.I., Mowrey, R.C., Brenner, D.W., White, C.T.

Materials Research Society

Brillson, L. J., Vitomirov, I. M., Raisanen, A., Chang, S, Viturro, R. E., Kirchner, P. D., Pettit, G. D., Woodall, J. …

Materials Research Society

LaVeigne,J.D., Carr,G.L., Lobo,R.P.S.M., Reitze,D.H., Tanner,D.B.

SPIE - The International Society for Optical Engineering

Hybertsen, Mark S., Schluter, Michael, Stechel, E.B., Jennison, D.R.

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12