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Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization

Author(s):
Publication title:
Proceedings of the fourth International Symposium on Ultra Large Scale Integration Science and Technology : ULSI science and technology/1993
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-13
Pub. Year:
1993
Page(from):
220
Page(to):
237
Pages:
18
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770637 [1566770637]
Language:
English
Call no.:
E23400/932028
Type:
Conference Proceedings

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