Estimation of W Polishing Characteristics During W-CMP with Iodate-Based Slurries

Estimation of W Polishing Characteristics During W-CMP with Iodate-Based Slurries

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

330

Page(to):

342

Pages:

13

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

Similar Items:

1 Conference Proceedings Tungsten CMP: Reduction Behavior of Iodate Ion on Tungsten Anik, M., Osseo-Asare, K. Electrochemical Society	7 Conference Proceedings Colloids and Surfaces in Chemical Mechanical Polishing: An Adsorptive Model for Abrasive Particle/Oxide Substrate Interactions Osseo-Asare, K. Electrochemical Society
2 Conference Proceedings Oxidation and Dissolution Characteristics of Tungsten: Application To Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	8 Conference Proceedings Kinetics of the Formation of Cu(I)BTA Films Al-Hinai, A., Osseo-Asare, K. Electrochemical Society
3 Conference Proceedings Concentration Gradient Effects in Tungsten Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	9 Conference Proceedings Electrodeposition of Iron in Aqueous Ferrous Sulfate Solution: Role of Ammonium Ion K. Osseo-Asare, M. Deelo, K. Weil Electrochemical Society
4 Conference Proceedings Aqueous Slurries in Chemical Mechanical Polishing: Adsorption of Silicate Ions by Ceria Osseo-Asare, K., Suphantharida, P. Electrochemical Society	10 Conference Proceedings Cerium Oxide Slurries in Chemical Mechanical Polishing: Silica/Ceria Interactions Suphantharida, P., Osaco-Asare, K. Electrochemical Society
5 Conference Proceedings Chemical-Mechanical Polishing of Metals: the Role of Metal Concentration Gradient Osseo-Asare, K. Electrochemical Society	11 Conference Proceedings Selection of an Oxidant for Copper CMP Anik, M. Electrochemical Society
6 Conference Proceedings Chemical-Mechanical Polishing of Tungsten: An Electrophoretic Mobility Investigation of Alumina-Tungstate Interactions Osseo-Asare, K., Khan, A. Electrochemical Society	12 Conference Proceedings Cathodic Reactions in Copper Chemical Mechanical Polishing: The Cu/Fe3+ and Cu/H202 Systems Al-Hinai, Ashraf T., Osseo-Asare, Kwadwo Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12