Combining a Finite Element Model and a Removal Model to Evaluate the Effect of Wafer and Pad Shape on Removal in CMP.
- Author(s):
- Publication title:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2003-21
- Pub. Year:
- 2003
- Page(from):
- 300
- Page(to):
- 307
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774048 [1566774047]
- Language:
- English
- Call no.:
- E23400/200321
- Type:
- Conference Proceedings
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