Evaluation of the Properties of Polyurethane Pads and their Correlation to the Perfonnance in the CMP Process

Evaluation of the Properties of Polyurethane Pads and their Correlation to the Perfonnance in the CMP Process

Author(s):

Zantye, P.

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

182

Page(to):

189

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

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