Optimization by Concentration of Oxidizer and Complexing Agent in Cu CMP Slurry

Optimization by Concentration of Oxidizer and Complexing Agent in Cu CMP Slurry

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

120

Page(to):

125

Pages:

6

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

Similar Items:

1 Conference Proceedings The Roles of Complexing Agents on Copper CMP Lim, G., Kim, T.E., Lee, J.-H., Kim, I., Lee, H-W. Electrochemical Society	7 Conference Proceedings Post-CMP Cleaning: Slurry-Induced Metallic Contaminations on Undoped and Doped Silicate Oxide Surfaces Han, S.H., Kim, S.-y., Ahn, H.-g., Kim, H.-j., Kim, J.-h., Lee, J.-g., Ko, C.-g. Electrochemical Society
2 Conference Proceedings Mechanochemical Synthesis of Nano-Sized CeO2 and its Application for CMP Slurry Lim, G., Lee, J.H., Kim, J.S., Lee, H.W., Hyun, S.H. Trans Tech Publications	8 Conference Proceedings Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries Patri, Udaya B., Pandija, S., Babu, S.V. Materials Research Society
3 Conference Proceedings Effect of Oxidizer on Copper And Tantalum in Copper CMP Lee, D.-W., Kim, N.-H., Kim, S.-Y., Kim, T.-H., Chang, E.-G. Electrochemical Society	9 Conference Proceedings Effect of Tin on the Microstructures and Mechanical Properties ofa Au-Pt-Cu Alloy Kim, M.H., Lee, S.H., Lim, H.N., Doh, J.M., Baik, H.G. Trans Tech Publications
4 Conference Proceedings Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP Eom, D.-H., Ryu, J.-S., Hong, Y.-K., Myung, J.-J., Kim, K.-S., Park, J.-G. Electrochemical Society	10 Conference Proceedings Glycerol-Based Slurry for Polyimide CMP Permana, D., Murarka, S.P., Lee, M.G., Beilin, S.I. Electrochemical Society
5 Conference Proceedings The Effect of Additives in Cu CMP Slurry on Cu Polishing Hong, Y.-K., Eom, D.-H., Park, J.-G. Electrochemical Society	11 Conference Proceedings Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP W. Tseng, D. Kioussis, S.L. Manikonda, H. Kim, J. Choi Electrochemical Society
6 Conference Proceedings Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries Eom, D.-H., Hong, Y.-K., Lee, S.-H., Park, J.-Y., Myung, J.-J., Park, J.-G., Kim, K.-S., Song, H.-S., Park, H.-S., Choi, … Electrochemical Society	12 Conference Proceedings Effect of Oxidizing Agent of Polypyrrole Layer Prepared by Vapor Polymerization Cho, J. H., Kim, J. S., Yu, J. B., Sohn, S. O., Huh, J. S. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12