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Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal

Author(s):
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-21
Pub. date:
2003
Page(from):
19
Page(to):
26
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774048 [1566774047]
Language:
English
Call no.:
E23400/200321
Type:
Conference Proceedings

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