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Ultra High Precision of the Tilt/Twist Misorientation Angles in Silicon/Silicon Direct Wafer Bonding

Author(s):
Fournel, F.
Monceau, H.
Leroy, F.
Eymery, J.
Gentile, P.
Rosseau, K.
Rouviere, J.-L.
2 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. Year:
2003
Page(from):
376
Page(to):
385
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

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