Hydrogen and Helium Implantation to Achieve Layer Transfer
- Author(s):
Lagahe-Blanchard, C. Sousbie, N. Sartori, S. Moriceau, H. Soubie, A. Aspar, B. Nguyen, P. Blondeau, B. - Publication title:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2003-19
- Pub. Year:
- 2003
- Page(from):
- 346
- Page(to):
- 367
- Pages:
- 22
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774024 [1566774020]
- Language:
- English
- Call no.:
- E23400/200319
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Single-Crystal Semiconductor Layer Delamination and Transfer Through Hydrogen Implantation
Electrochemical Society |
Electrochemical Society |
2
Conference Proceedings
New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
4
Conference Proceedings
Smart-Cut Technology: An Industrial Application of Ion-Implantation-Induced Cavities
MRS - Materials Research Society |
Kluwer Academic Publishers |
Electrochemical Society |
Electrochemical Society |
6
Conference Proceedings
Direct Wafer Bonding and Thinning Down: A Generic Technology to Perform New Structures
Electrochemical Society |
Electrochemical Society |