Blank Cover Image

Bonding and Contacting of MEMS-Structures on Wafer Level

Author(s):
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. date:
2003
Page(from):
301
Page(to):
308
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

Similar Items:

Wiemer, M., Hiller, K., Hahn, R., Kaufmann, C., Gessner, T.

Electrochemical Society

Lohmann, C., Bertz, A., Kuechler, M., Reuter, D., Gessner, T.

SPIE-The International Society for Optical Engineering

Knechtel, R., Heller, J., Wiemer, M., Fromel, J.

Electrochemical Society

C. Yun, J. Martin, L. Chen, T.J. Frey

Electrochemical Society

M. Wiemer, M. Haubold, C. Jia, D. Wuensch, J. Froemel

Electrochemical Society

9 Conference Proceedings Wafer Bonding for Optical MEMS

Bakke, T., Volker, B., Schenk, H., Radu, I., Reiche, M.

Electrochemical Society

Gessner, T., Wiemer, M., Hiller, K., Hafen, M.

Electrochemical Society

10 Conference Proceedings Wafer Bonding for MEMS

Enoksson, P., Rusu, C., Sanz-Velasco, A., Bring, M., Nafari, A., Bengtsson, S.(Invited)

Electrochemical Society

F. Sari, M. Wiemer, M. Bernasch, J. Bagdahn

Electrochemical Society

Chen, S., Ma, H., Chen, M., Xiong, T., Liu, S., Yi, X.

SPIE - The International Society of Optical Engineering

Wierner, M., Hiller, K., Gessner, T.

Electrochemical Society

Petzold, M., Katzer, D., Wiemer, M., Bagdahn, J.

SPIE-The International Society for Optical Engineering

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12