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Characteristics and Applications of Silicon Direct Bonded Interfaces

Author(s):
McCann, P.
Devine, C.
Ruddell, F.
Baine, P.
Gamble, H.S.
Nevin, W.A.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. Year:
2003
Page(from):
154
Page(to):
165
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

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