Advanced SOI Structures Based on Wafer Bonding: A Short Review

Advanced SOI Structures Based on Wafer Bonding: A Short Review

Author(s):: Ghyselen, B.
Publication title:: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:: Electrochemical Society Proceedings Series
Ser. no.:: 2003-19
Pub. Year:: 2003
Page(from):: 96
Page(to):: 109
Pages:: 14
Pub. info.:: Pennington, NJ: Electrochemical Society
ISSN:: 01616374
ISBN:: 9781566774024 [1566774020]
Language:: English
Call no.:: E23400/200319
Type:: Conference Proceedings

Details

TDL ID:	ZA00014082
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Semiconductor Wafer Bonding ; Electrochemical Society Meeting
Conf. info. (Number):	7th ; 2003
Conf. info. (Venue):	Paris, France
Conf. info. (Date):	2003.04.27-2003.05.02

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