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Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Author(s):
Lu, J.-Q.
Jindal, A.
Kwon, Y.
McMahon, J.J.
Lee, K.-W.
Kraft, R.P.
Altemus, B.
Cheng, D.
Eisenbraun, E.
Cale, T.S.
Gutmann, R.J
6 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. Year:
2003
Page(from):
87
Page(to):
95
Pages:
9
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

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