Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration
- Author(s):
Lu, J.-Q. Kwon, Y. Jindal, A. McMahon, J.J. Cale, T.S. Gutmann, R.J. - Publication title:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2003-19
- Pub. Year:
- 2003
- Page(from):
- 76
- Page(to):
- 86
- Pages:
- 11
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774024 [1566774020]
- Language:
- English
- Call no.:
- E23400/200319
- Type:
- Conference Proceedings
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