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Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

Author(s):
Ruddell, F.
Bain, M.
Suder, S.
Hurley, R.E.
Armstrong, B.M.
Fusco, V.F.
Gamble, H.S.
2 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. Year:
2003
Page(from):
25
Page(to):
30
Pages:
6
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

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