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Investigation of Barrier Layers for Cu-Ultra Low-k Porous Polymer Integration

Author(s):
Yang, L.Y.
Zhang, D.H
Li, C.Y.
Foc, P.D.
Prasad, K.
Tan, C.M.
1 more
Publication title:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-13
Pub. Year:
2003
Page(from):
174
Page(to):
180
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773935 [1566773938]
Language:
English
Call no.:
E23400/200313
Type:
Conference Proceedings

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