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A Novel Approach for Dual Damascene Trench Etch for 90 nm Low-k Inter- Connect with No Middle Etch Stop Layer

Author(s):
Chen, T.Q.
Cong, H.
Liu, W.P.
Siew, Y.K.
Pradeep, Y.
Hsia, L.C.
Jaiswal, R.
Jain, A.
Sim, I.
4 more
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-10
Pub. Year:
2003
Page(from):
182
Page(to):
187
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200310
Type:
Conference Proceedings

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