The Proposal of All-Wet Fabrication Process for ULSI Interconnects Technologies - Application of Electroless NiB Deposition to Capping and Barrier Layers

The Proposal of All-Wet Fabrication Process for ULSI Interconnects Technologies - Application of Electroless NiB Deposition to Capping and Barrier Layers

Author(s):

Publication title:

Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-10

Pub. Year:

2003

Page(from):

137

Page(to):

145

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772945 [156677294X]

Language:

English

Call no.:

E23400/200310

Type:

Conference Proceedings

Details

TDL ID:	ZA00014074
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
Conf. info. (Number):	2000 ; 198th
Conf. info. (Venue):	Phoenix, AZ, USA
Conf. info. (Date):	2000.10.22-2000.10.27

Similar Items:

1 Conference Proceedings Formation of Diffusion Barrier Layer on Low-k Material Using Wet Fabrication Process Yoshino, M., Yokoshima, T., Osaka, T., Hashimoto, A., Hagiwara, Y., Sato, I. Electrochemical Society	7 Conference Proceedings Interconnection of Multi-Pad Electrodes by “Controlled Anisotropic Extraneous (CAEx) Deposition” of Electroless NiB Film T. Yokoshima, Y. Yamaji, N. Igawa, Y. Tamura, K. Kikuchi Electrochemical Society
2 Conference Proceedings 32. Electroless NiB Deposition for Micro-Patterned Formation Takai, M., Takefusa, S., Yokoshima, T., Osaka, T. Electrochemical Society	8 Conference Proceedings Electroless Deposition of Cu and Ag For ULSI Interconnect Fabrication J. Kim, C. Lee, A. Kim, S. Kim Electrochemical Society
3 Conference Proceedings Development of High-performance Soft Magnetic Thin Films by Electroless Deposition and their Application to Magnetic Recording Devices Osaka, T., Yokoshima, T. Electrochemical Society	9 Conference Proceedings Activation Methods For Electroless Copper Deposition Of Seeding Layer For ULSI Copper Interconnect Metallization Tse, M S, Tan, K T, Goh, W L, Liu, K Y Electrochemical Society
4 Conference Proceedings Electroless Nickel Ternary Alloy Deposition on SiO2 for Application to Diffusion Barrier Layer in Copper Interconnects Technology Osaka, T., Takano, N., Kurokawa, T., Ueno, K. Electrochemical Society	10 Conference Proceedings Tapping Mode Atomic Force Microscopy Analysis of Electroless-Deposition Process Homma, T., Tanabe, M., Suzuki, M., Osaka, T. Electrochemical Society
5 Conference Proceedings Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to “Chemical” Flip-Chip Bonding T. Yokoshima, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa Electrochemical Society	11 Conference Proceedings Fabrication of High-B, Soft Magnetic Thin Films by an Electrodeposition Technique for Next-Generation Magnetic Recording Field Osaka, T., Yokoshima, T., Nakanishi, T. Electrochemical Society
6 Conference Proceedings Fabrication of the Electroless NiMoB Films as a Diffusion Barrier Layer on the Low-k Substrate M. Yashino, T. Masuda, S. Wakaisuki, J. Sasano, I. Matsuda, Y. Shacham-Diamand, T. Osaka Electrochemical Society	12 Conference Proceedings In Situ Analysis of the Deposition Process of Electroless CoNiP Perpendicular Magnetic Recording Media Homma, T., Shiokawa, J., Sezai, Y., Osaka, T Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12