Blank Cover Image

Fabrication Techniques for the Packaging of MEMS Chip Scale Packages and Multichip Modules;

Author(s):
Saia, R. ( GE, Schnectady, NY )  
Publication title:
Proceedings from the tenth Meeting of the Symposium on Polymers for Microelectronics [May 8th, 9th, & 10th, 2002]
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-16
Pub. Year:
2002
Page(from):
685
Page(to):
699
Pages:
15
Pub. info.:
[S.l.]: Electrochemical Society
ISSN:
01616374
Language:
English
Call no.:
E23400/200216
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Extension of high-density interconnect multichip module technology for MEMS packaging

Butler,J.T., Bright,V.M., Saia,R.J., Comtois,J.H

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Fabrication and Characterization of a High Temperature Superconducting Multichip Module

Cooksey, J.W., Brown, W.D., Schaper, L.W., Florence, R.G., Scott, S.S., Afonso, S.

Electrochemical Society
2 Conference Proceedings Design and fabrication of optoelectronic multichip module prototypes using MEMS fabrication techniques

Koh,S., Sadler,D.J., Oh,K., Roenker,K.P., Ahn,C.H.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings DEMONSTRATION OF A CHIP SCALE,CHIP-ON-FLEX TECHNOLOGY

Fillion,Raymond A., Wojnarowski,Robert, Saia,Rich, Kuk,Don

SPIE-The International Society for Optical Engineering
3 Conference Proceedings Integratio Techniques for MMICs and Chip Devices in LTCC Multichip Modules for Radio Frequencies

Kulke,R., Simon,W., Rittweger,M., Wolff,I., Baker,S., Powell,R., Harrison,M.

IMAPS
9 Conference Proceedings Laser processes for multichip module's high-density multilevel thin film packaging

Patel,R.S., Wassick,T.A.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings High-G Multichip Modules for Defense Systems Using HDI

W. Daum, R.J. Saia, R.A. Fillion, G.A. Forman, T.R. Gennaro

Society of Photo-optical Instrumentation Engineers
10 Conference Proceedings A Chip-on-Chip DSP/SRAM Multichip Module

King L. Tai, Robert C. Frye, Byung J. Han, Maureen Y. Lau

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings SUBSTRATE REQUIREMENTS FOR EFFECTIVE INTEGRATION OF CHIP SCALE PACKAGES AND MULTICHIP MODULES IN PORTABLE WIRELESS PRODUCTS

Swirbel,Tom

IMAPS
11 Conference Proceedings MICROJET PRINTING OF SOLDER AND POLYMERS FOR MULTI-CHIP MODULES AND CHIP-SCALE PACKAGES

Hayes,Donald J., Wanace,David B., Cox,W.Royall

IMAPS
6 Conference Proceedings Guided-wave optoelectronic clock-distribution networks on multichip modules using MEMS fabrication techniques

Koh,S., Suh,S.-D., Wu,D., Lantz,M.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Rapid Prototype Fabrication of Custom Chip Scale Packages

Owens, Megan M., Soucy, Joseph W., Marinis, Thomas F., Clausen, Henry G.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12