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Electrical and Material Stabilities of Cu/FSG and Cu/OSG at Elevated Temperatures

Author(s):
Publication title:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-22
Pub. Year:
2002
Page(from):
331
Page(to):
338
Pages:
8
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
Language:
English
Call no.:
E23400/200222
Type:
Conference Proceedings

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