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Proven Extendibility of Low Damage Cu-CMP Process for Sub-0.13 μm ULSI Interconnects

Author(s):
Tsai, T.C.
flu, S.C.
Lin, Z.H.
Hsu, S.H.
Hsu, C.L.
Dai, J.
Yang, F.
Lin, M.H.
Chen, H.C.
Hsieh, W.Y.
5 more
Publication title:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-22
Pub. Year:
2002
Page(from):
325
Page(to):
330
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
Language:
English
Call no.:
E23400/200222
Type:
Conference Proceedings

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