Blank Cover Image

Plasma Charging Damages for Gate Oxide and Hot-Carrier Degradation and Electro-migration Properties in Cu Interconnects

Author(s):
So, D.S.
Wang, J.J.
Yang, C.T.
Chen, D.H
Theng, H.C.
Chen, H.
Lee, S.Y.
2 more
Publication title:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-22
Pub. Year:
2002
Page(from):
310
Page(to):
315
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
Language:
English
Call no.:
E23400/200222
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Hot Carrier Reliability of ALD HfSiON Gated MOSFETs with Different Compositions

H. Chen, S. Chen, C. Lu, C. Liu, F. Chiu

Electrochemical Society
7 Conference Proceedings Plasma Process Induced Physical Damage on Ultra Thin Gate Oxide

Lee, H.C., Vanhaelemeersch, S.

Electrochemical Society
2 Conference Proceedings Hot carrier degradation of fully depleted SIMOX MOSFETs

Sinha, S P, Ii, F D, loonnou, D E, Jenkins, W C, Hughes, H L, Lin, M S

Electrochemical Society
8 Conference Proceedings A Study on Kinetics Parameters of Titanium Hydride Powder from Its TPD Spectrum for Metal Foam

D.H. Yang, S.Y. Kim, B.Y. Hur

Trans Tech Publications
3 Conference Proceedings Grain Refinement and Texture Evolution during Equal Channel Angular Extrusion of Pure Cu and Cu-Zn Alloys

H.H. Chen, S.Y. Li, D.H. Zhang, X. Huang

Trans Tech Publications
9 Conference Proceedings Hot Carrier Effects in Self-Aligned and Offset-Gated Polysilicon Thin-Film Transistors

Arpatzanis, N., Hatzopoulos, A.T., Tassis, D.H., Dimitriadis, Charalambos, Kamarinos, G.

Materials Research Society
4 Conference Proceedings Gate-to Drain Capacitance as a Monitor for Hot-Carrier Degradation in Sbmictometer MOSFETs

Ling, C.H.

Electrochemical Society
10 Conference Proceedings Enhancing the Bonding Strength of Plasma-Sprayed HA Coating on Pure Ti

S. Yang, H.C. Man

Trans Tech Publications
5 Conference Proceedings Proven Extendibility of Low Damage Cu-CMP Process for Sub-0.13 μm ULSI Interconnects

Tsai, T.C., flu, S.C., Lin, Z.H., Hsu, S.H., Hsu, C.L., Dai, J., Yang, F., Lin, M.H., Chen, H.C., Hsieh, W.Y.

Electrochemical Society
11 Conference Proceedings Breakdown Characteristics of Ultrathin Gate Oxides Caused by Plasma Charging

Chen, C-C., Lin, H-C., Chang, C-Y., Chien, C-H., Huang, T-Y.

MRS - Materials Research Society
6 Technical Paper Development of Eco-Driving Guide System.

Kim, S.Y., Shin, D.J., Yoon, H.J., Bae, H.C., Kim, D.S.

Society of Automotive Engineers
12 Conference Proceedings A systematic approach for capturing interconnects hot spots

M. Al-Imam, H. Y. Liao, J. Schacht, T. H. Wu, C. W. Huang, S. Y. Huang, P. R. Tsai, C. H. Yang

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12