Self-Annealing Effect of Electrolessly Deposited Copper Thin Films Based on CO(II)-Ethylenediamine as a Reducing Agent

Self-Annealing Effect of Electrolessly Deposited Copper Thin Films Based on CO(II)-Ethylenediamine as a Reducing Agent

Author(s):

Publication title:

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2002-22

Pub. Year:

2002

Page(from):

84

Page(to):

91

Pages:

8

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773799 [1566773792]

Language:

English

Call no.:

E23400/200222

Type:

Conference Proceedings

Details

TDL ID:	ZA00014055
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
Conf. info. (Number):	2002 ; 202nd
Conf. info. (Venue):	Salt Lake City, UT, USA
Conf. info. (Date):	2002.10.20-2002.10.24

Similar Items:

1 Conference Proceedings Thin electroless barrier for copper films Lopatin,S.D., Shacham-Diamand,Y.Y., Dubin,V.M., Kim,Y.S., Vasudev,P.K. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Electroless Copper Deposition Process Using Glyoxylic Acid as a Reducing Agent H. Honma, T. Kobayashi Electrochemical Society
2 Conference Proceedings PREPARATION AND MICROSTRUCTURAL CHARACTERIZATION OF FERROELECTRIC THIN FILM PbTiO3 ON Si, MgO, AND SAPPHIRE DEPOSITED BY DC REACTIVE MULTITARGET CO-SPUTTERING Kim, K.Y., Hwang, H.I., Lee, J.Y., Choo, W.K. Materials Research Society	8 Conference Proceedings Magnetoimpedance Effect in Mumetal Thin Films Cho, W.-S., Lee, H., Yoon, T.-S., Lee, K.-J., Kim, C.-O. Trans Tech Publications
3 Conference Proceedings Self-Annealing Textures of Copper Damascene Interconnects Lee, D. N., Lee, H. J. Trans Tech Publications	9 Conference Proceedings Annealing Characteristics of Electron-Beam Evaporated Magnesium Oxide Thin Film Kang, Y. C., Baik, J. B., Lee, B. H., Choi, J. H., Kim, J. M., Park, K. Y. MRS - Materials Research Society
4 Conference Proceedings The Roles of Complexing Agents on Copper CMP Lim, G., Kim, T.E., Lee, J.-H., Kim, I., Lee, H-W. Electrochemical Society	10 Conference Proceedings Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application Kim, D.G., Bae, J.S., Lee, J.H., Kim, Y.D., Ahn, Y.M. Trans Tech Publications
5 Conference Proceedings Thickness effect on the crystallization kinetics of electrolessly-deposited Ni(P) thin films Shi, L. T., O'Sullivan, E. J. M. MRS - Materials Research Society	11 Conference Proceedings CO2 laser annealing with NiTi thin films deposited by sputtering He, Q., Huang, W., Hong, M., Chong, T.C., Fu, Y., Du, H. SPIE - The International Society of Optical Engineering
6 Conference Proceedings EFFECT OF POST-ANNEALING ON ELECTRICAL PROPERTIES OF Ta2O5 THIN FILM DEPOSITED BY PECVD USING TaCl5 AND N2O Park, Jong-Wan, Han, S. W., Moon, H. S., Lee, J. S. MRS - Materials Research Society	12 Conference Proceedings Direct Electroless Copper Plating on Polyimide for FPCB Applications J.H. Lee Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12