Multi-scale Simulations of Copper Electrodeposition onto a Resistive Substrate

Multi-scale Simulations of Copper Electrodeposition onto a Resistive Substrate

Author(s):

Publication title:

Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2002-22

Pub. Year:

2002

Page(from):

30

Page(to):

45

Pages:

16

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773799 [1566773792]

Language:

English

Call no.:

E23400/200222

Type:

Conference Proceedings

Details

TDL ID:	ZA00014055
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
Conf. info. (Number):	2002 ; 202nd
Conf. info. (Venue):	Salt Lake City, UT, USA
Conf. info. (Date):	2002.10.20-2002.10.24

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