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Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries

Author(s):
Eom, D.-H.
Hong, Y.-K.
Lee, S.-H.
Park, J.-Y.
Myung, J.-J.
Park, J.-G.
Kim, K.-S.
Song, H.-S.
Park, H.-S.
Choi, Y.-S.
5 more
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-1
Pub. date:
2002
Page(from):
226
Page(to):
236
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773294 [1566773296]
Language:
English
Call no.:
E23400/2002-1
Type:
Conference Proceedings

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