Ellipsometry Characterization of Copper Complex Layers for Abrasive-free Chemical Mechanical Polishing

Ellipsometry Characterization of Copper Complex Layers for Abrasive-free Chemical Mechanical Polishing

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2002-1

Pub. Year:

2002

Page(from):

176

Page(to):

183

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773294 [1566773296]

Language:

English

Call no.:

E23400/2002-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00014034
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	5th ; 201st
Conf. info. (Venue):	Philadelphia, PA, USA
Conf. info. (Date):	2002.05.12-2002.05.17

Similar Items:

1 Conference Proceedings Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing Lee, S.-M., Abiade, J., Choi, W., Singh, R. Electrochemical Society	7 Conference Proceedings Abrasive-free Polishing for ULSI Cu Damascene Interconnects Fang, J-Y., Tsai, M-S., Dai, B-T., Feng, M-S. Electrochemical Society
2 Conference Proceedings Why Abrasive Free Cu Slurry is Promising Kamigata, Yasuo, Kurata, Yasushi, Masuda, Katsuyuki, Amanokura, jin, Yoshida, Masao, Hanazono, Masanobu Materials Research Society	8 Conference Proceedings Investigation of Abrasive Free Copper Chemical Mechanical Planarization Process for Cu/Low k and Cu/Ultra Low k Interconnects Balakumar, S., Haque, T., Kumar, R., Kumar, A.S., Rahman, M. Materials Research Society
3 Conference Proceedings The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing Tsai, H.J., Chang, C.C., Jeng, Y.R., Chen, S.L. Trans Tech Publications	9 Conference Proceedings Characterization of Chemical Mechanical Polishing of Copper Wijekoon, Kapila, Tsai, Stan, Bennett, Doyle, Redeker, Fritz Electrochemical Society
4 Conference Proceedings Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives J.C. Tsai, J.F. Kao Trans Tech Publications	10 Conference Proceedings Copper Removal from Chemical Mechanical Polishing Effluent Riley, C., Filson, J., Mendicino, L., Brown, P.T. Electrochemical Society
5 Conference Proceedings In-Situ Formation of Ag Capping Layer in Copper Chemical Mechanical Polishing M. Kang, S. Cho, J. Kim Electrochemical Society	11 Conference Proceedings Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum Li, Y., Jindal, A., Babu, S.V. Electrochemical Society
6 Conference Proceedings SURFACE LAYER FORMATION DURING THE CHEMICAL MECHANICAL POLISHING OF COPPER THIN FILMS Steigerwald, J. M., Murarka, S. P., Duquette, D. J., Gutmann, R. J. MRS - Materials Research Society	12 Conference Proceedings Abrasive Effects in Oxide Chemical-Mechanical Polishing Bielnann, M., Mahajan, V., Singh, R. K. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12