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Polish Rate, Pad Surface Morphology and Pad Conditioning in Oxide Chemical Mechanical Polishing

Author(s):
Lawing, A.S.  
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-1
Pub. Year:
2002
Page(from):
46
Page(to):
60
Pages:
15
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773294 [1566773296]
Language:
English
Call no.:
E23400/2002-1
Type:
Conference Proceedings

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