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High Performance CMOS on SOI

Author(s):
Yang, I.Y.
Fung, S.
Sleight, J.
Narasimha, S.
Zamdmer, N.
Smeys, P.
Welser, J.
Agnello, P.
Leobandung, E.
Shahidi, G.
5 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-27
Pub. date:
2001
Page(from):
177
Page(to):
196
Pages:
20
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
Language:
English
Call no.:
E23400/200127
Type:
Conference Proceedings

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