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Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration

Author(s):
Kwon, Y.
Lu, J.-Q.
Gutmann, R.J.
Kraft, R.P.
McDonald, J.
Cale, T.S.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-27
Pub. date:
2001
Page(from):
145
Page(to):
154
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
Language:
English
Call no.:
E23400/200127
Type:
Conference Proceedings

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