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Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer

Author(s):
Suder, S.L.
Hurley, R.
Li, F.X.
Bain, M.
Baine, P.
MeNeill, D.W.
Armstrong, B.M.
Gamble, H.S.
3 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-27
Pub. date:
2001
Page(from):
19
Page(to):
19
Pages:
1
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
Language:
English
Call no.:
E23400/200127
Type:
Conference Proceedings

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