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Overview on Some Recent Advances in Wafer Bonding Technologies

Author(s):
Moriceau, H.
Fournel, F.
Rayssac, O.
Cartier, A.M.
Morales, C.
Pocas, S.
Zussy, M.
Jalaguier, E.
Biasse, B.
Bataillou, B.
Papon, A.M.
Lagahe, C.
Aspar, B.
Maleville, C.
Leterte, F.
Ghyselen, B.
Barge, T.
12 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-27
Pub. date:
2001
Page(from):
1
Page(to):
16
Pages:
16
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
Language:
English
Call no.:
E23400/200127
Type:
Conference Proceedings

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