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NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING

Author(s):
Lee, S.-Y.
Lee, S.-H.
Eom, D.-H.
Kim, K.-S.
Song, H.-S.
Park, J.-G.
1 more
Publication title:
Cleaning technology semiconductor device manufacturing : proceedings of the seventh international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-26
Pub. date:
2001
Page(from):
180
Page(to):
186
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773591 [1566773598]
Language:
English
Call no.:
E23400/200126
Type:
Conference Proceedings

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