NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING

NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING

Author(s):

Lee, S.-Y.

Publication title:

Cleaning technology semiconductor device manufacturing : proceedings of the seventh international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2001-26

Pub. Year:

2001

Page(from):

180

Page(to):

186

Pages:

7

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773591 [1566773598]

Language:

English

Call no.:

E23400/200126

Type:

Conference Proceedings

Details

TDL ID:	ZA00014030
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing ; Fall Meeting of the Electrochemical Society
Conf. info. (Number):	7th ; 2001
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2001.09.00

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