Blank Cover Image

Feature Scale Modeling of Transient Processes in Copper ECD

Author(s):
Publication title:
Thin film materials, processes, and reliability : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-24
Pub. Year:
2001
Page(from):
85
Page(to):
94
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773577 [1566773571]
Language:
English
Call no.:
E23400/200124
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Microloading During Electrochemical Deposition: Integrated Multiscale Process Simulation

Bloomfield, M.O., Soukane, S., Jansen, K.E., Cale, T.S.

Electrochemical Society
7 Conference Proceedings Modeling of ionized magnetron sputtering of copper

Bloomfield, M. O., Cale, T. S.

MRS-Materials Research Society
2 Conference Proceedings One Approach to Combining Equipment Scale and Feature Scale Models

Gobbert, M.K., Cale, T.S., Ringhofer, C.A.

Electrochemical Society
8 Conference Proceedings Vertical Integration of CVD Process Models

Gobbert, M.K., Merchant, T.P., Borucki, L.J., Cale, T.S.

Electrochemical Society
3 Conference Proceedings Electrochemical Deposition of Copper in Microstruetures

Soukane, S., Sen, S., Gale, T.

Electrochemical Society
9 Conference Proceedings CMP Finite Element Contact Model: Wafer and Feature Scale

Kim, A., Williams, M.K.R., Tichy, J., Cale, T.

Electrochemical Society
4 Conference Proceedings Integrated Multiscale Process Simulation: Reactor Scale to Grain Scale

Bloomfield, M.O., Jansen, K.E., Cale, T.S.

Electrochemical Society
10 Conference Proceedings A Feature Scale Transport and Reaction Model for Atomic Layer Deposition

Gobbert, M.K., Cale, T.J.

Electrochemical Society
5 Conference Proceedings A Multi-Scale Elasto-Hydrodynamic Contact Model of Chemical Mechanical Planarization

Kim, A., Tichy, J.A., Cale, T.S.

Electrochemical Society
11 Conference Proceedings Transient Thermal and Mechanical Modeling of 3D-IC Structures

Zhang, I., Lu, J.-Q., Gutmann, R.I., Cale, T.S.

Electrochemical Society
6 Conference Proceedings Modeling of Ionized Physical Vapor Deposition of Copper

Bloomfield, M.O., Richards, D.F., Cale, T.S.

Electrochemical Society
12 Conference Proceedings Transient 3-D / 3-D Transport and Reactant-Wafer Interactions: Adsorption and Desorption

Webster, S.G., Gobbert, M.K., Cale, T.S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12