Blank Cover Image

Front- to back-wafer overlay accuracy in substrate transfer technologies

Author(s):
Publication title:
Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-17
Pub. Year:
2001
Page(from):
356
Page(to):
367
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773508 [1566773504]
Language:
English
Call no.:
E23400/200117
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Characterization of front- to backwafer alignment and bulk micromachining using electrical overlay test structures

van Zeijl, H.W., Slabbekoorn, J.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings THE INSERTION OF SINGLE-WAFER INTEGRATED THERMAL/CVD TECHNOLOGY IN FRONT-END AND BACK-END OF THE LINE PROCESSING; LESSONS LEARNED

Kermani, A., Omstead, T., Moslehi, M., Spence, P., Winters, W.

MRS - Materials Research Society
2 Conference Proceedings Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micromachining using electrical overlay test structures

van Zeijl, H. W., Bijnen, F. G. C., Slabbekoorn, J.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Front-to-back alignment metrology

Bijnen, F.G.C., Buel, W., Gui, C.Q., Lof, J.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings 3D align overlay verification using glass wafers

Smeets, E. M. J., Bijnen, F. G. C., Slabbekoorn, J., van Zeijl, H. W.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings * EPITAXIAL GROWTH ON SIMOX WAFERS

Lam, H.W.

Materials Research Society
4 Conference Proceedings Backwafer optical lithography and wafer distortion in substrate transfer technologies

Zeijl,H.W.van, Slabbekoom,J., Nanver,L.K., Dijk,P.W.L.Van, Berthold,A., Machielsen,T.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Advances in process overlay on 300-mm wafers

Staecker, J., Arendt, S., Schumacher, K., Mos, E.C., van Haren, R.J., van der Schaar, M., Edart, R., Demmerie, W., …

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Waferstepper Alignment For MEMS Applications Using Diffraction Gratings

Zeijl, H.W. van, Simon, K., Slabbekoorn, J., Buel, W.v., Gui, C.Q.

Materials Research Society
11 Conference Proceedings Improving the accuracy of overlay measurement through wafer sampling map rearrangement

Chungwei Hsu, Ronfu Chu, Jen H. Chen

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Improving the accuracy of overlay measurements through reduction in tool-and wafer-induced shifts

Preil,M.E., Plambeck,B.F., Uziel,Y., Zhou,H., Melvin,M.W.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Layer Transfer onto a Dissimilar Material Substrate by Wafer Bonding and Layer Splitting

Lee, T.H., Tong, Q.-Y., Zhang, H.-Z., Ding, X.-F., Sin, J.K.O.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12