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Post-ECP Annealing For Advanced Copper Interconnect Application

Author(s):
Zhang, Y.
Koh, L.T.
Li, C.Y.
Liu, H.
You, G.Z
Wu, J.J.
Xie, J.
2 more
Publication title:
Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-17
Pub. Year:
2001
Page(from):
78
Page(to):
87
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773508 [1566773504]
Language:
English
Call no.:
E23400/200117
Type:
Conference Proceedings

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