
Coopper Oxide Removal By In-situ Plasma Pre-Treatment For Improved Copper To Dielectric Barrier Adhesion
- Author(s):
Lim, Y.K. Goh, W.L. Tse, M.S. Tse, T.Y. Seet, C.S. Lu, W. Randall Cha, C.L. Adebanjo, Ricky Steiner, Kurt G. - Publication title:
- Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2001-17
- Pub. date:
- 2001
- Page(from):
- 55
- Page(to):
- 65
- Pages:
- 11
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773508 [1566773504]
- Language:
- English
- Call no.:
- E23400/200117
- Type:
- Conference Proceedings
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