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Coopper Oxide Removal By In-situ Plasma Pre-Treatment For Improved Copper To Dielectric Barrier Adhesion

Author(s):
Lim, Y.K.
Goh, W.L.
Tse, M.S.
Tse, T.Y.
Seet, C.S.
Lu, W.
Randall
Cha, C.L.
Adebanjo, Ricky
Steiner, Kurt G.
5 more
Publication title:
Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-17
Pub. date:
2001
Page(from):
55
Page(to):
65
Pages:
11
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773508 [1566773504]
Language:
English
Call no.:
E23400/200117
Type:
Conference Proceedings

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