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Atomic-Layer Cleaving for SOI Wafer Fabrication and a Path Towards Laminated Electronics

Author(s):
Current, M.I.
Malik, I.J.
Bedell, S.W.
Kirk, H.
Korolik, M.
Kang, S.
Henley, F.J.
2 more
Publication title:
Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2001-3
Pub. Year:
2001
Page(from):
75
Page(to):
78
Pages:
4
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773096 [1566773091]
Language:
English
Call no.:
E23400/2001-3
Type:
Conference Proceedings

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