Blank Cover Image

Effective Polymer and Etch Residue Removal Using Single-Wafer Processing

Author(s):
Peters, D.
Egbe, M.
Ravito, R.
Rieker, J.
Fiener, S.
Tea, T.
Seong, T.-K.
Nguyen, L.V.
Henry, S-A.
Gaulhofer, F.
Haigernioser, C.
DeBear, D.
7 more
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-27
Pub. Year:
2000
Page(from):
213
Page(to):
219
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200027
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings EFFECTIVE POST-ETCH RESIDUE REMOVAL ON LOW-K FILMS USING SINGLE WAFER PROCESSING

Kesters, E., Ghekiere, J., Van Doorne, P., Vereecke, G., Mertens, P.W., Heyns, M.M.

Electrochemical Society
7 Conference Proceedings Planarization of Copper Damascene Interconnects by Spin-Etch Process: A Chemical Approach

Mukherjee, S.P., Levert, J.A., DeBear, D.S.

Materials Research Society
2 Conference Proceedings Single Wafer Polymer Removal for <0.25mm Technology

Gaulhofer, E., Kruwinus, H.-.1., Kovacs, F., Haigermoser, C.

Electrochemical Society
8 Conference Proceedings A Novel Spin-Etch Planarization Process for Dual-Damascene Copper Interconnects

Levert, J., Mukherjee, S., DeBear, D., Fury, M.

Electrochemical Society
3 Conference Proceedings Supercritical CO2 Post-Etch Cleaning of a Patterned Porous Low-k Dielectnc

Peters, D., Egbe, M., Ficner, S., Masuda, K., Iijima, K., Yashikawa, T, Asai, G., Muraoka, Y., Saito, K., Mizobata, I., …

Electrochemical Society
9 Conference Proceedings Dry etch yield enhancement by use of after-develop inspection

Kalk,F.D., Brankner,K.J., Peters,L., Vacca,A., Pomeroy,S., Emery,D.

SPIE - The International Society for Optical Engineering
4 Conference Proceedings SINGLE WAFER POLYMER REMOVAL FOR <0.25um TECHNOLOGY

Nguyen, Lac Van, Teo, Thomas, Maw, Taishih, Henry, Sally Ann

Electrochemical Society
10 Conference Proceedings COPPER LOW-k CONTAMINANTION AND POST ETCH RESIDUES REMOVAL USING SUPERCRITICAL C02-BASED PROCESSES

Millet, C., Daviot, J., Danel, A., Perrut, V., Tardif, F., Broussous, L., Renault, O.

Electrochemical Society
5 Conference Proceedings Comparison of Polysilicon Etch Processes Using Single Wafer and Batch Reactors

Mautz, K., Alzaben, T.

Electrochemical Society
11 Conference Proceedings Removal of surface oxide from electrical test (E-test) pads using an argon sputter etch procedure to recover TAB wafers

Petersen-Buchheit,T.A., Johannes,W.R., Patel,D.N., Coleman,J.F.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings A Novel Concept for Contact Etch Residue Removal

I.J. Vos, D. Hellin, S. Demuynck, O. Richard, T. Conard

Electrochemical Society
12 Conference Proceedings BENEFITS OF SINGLE WAFER POLYMER REMOVAL WITH INORGANIC CHEMICALS ON FEOL AND BEOL STRUCTURES OF DRAMS

C. Haigermoser, S. A. Henry, E.-S. Rho, J. Song, H. Kim

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12