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Electromigration in Two-Level Cu Interconnections with a Low Dielectric Constant Inter-Level Insulator

Author(s):
Hu, C-K.
Gignac, L.
Liniger, F.
Rosenberg, R.
Agarwala, B.
Rathore, H.S.
Chen, X.
2 more
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-27
Pub. Year:
2000
Page(from):
112
Page(to):
119
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200027
Type:
Conference Proceedings

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