Blank Cover Image

A Novel Contact Displacement Method for Cu Interconnect Fabrication

Author(s):
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-27
Pub. Year:
2000
Page(from):
23
Page(to):
31
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200027
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Abrasive-free Polishing for ULSI Cu Damascene Interconnects

Fang, J-Y., Tsai, M-S., Dai, B-T., Feng, M-S.

Electrochemical Society
7 Conference Proceedings Proven Extendibility of Low Damage Cu-CMP Process for Sub-0.13 μm ULSI Interconnects

Tsai, T.C., flu, S.C., Lin, Z.H., Hsu, S.H., Hsu, C.L., Dai, J., Yang, F., Lin, M.H., Chen, H.C., Hsieh, W.Y.

Electrochemical Society
2 Conference Proceedings A Novel Fabrication of Cu-Mn Alloy Films by Chemical Displacement Process

L. Lin, W. Yang, M. Dai, T. Yang, C. Yang

Electrochemical Society
8 Conference Proceedings Nanofabrication of nanopattern and microdevices using contact/proximity lithography

Ting, Y.-C., Shy, S.-L., Lee, M.-C., Dai, B.-T.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings ELECTROMIGRATION IN Al/W AND Al(Cu)/W INTERCONNECT STRUCTURES

Hu, C-K., Ho, P. S., Small, M. B., Kelleher, K.

Materials Research Society
9 Conference Proceedings Electroless Deposition of Cu and Ag For ULSI Interconnect Fabrication

J. Kim, C. Lee, A. Kim, S. Kim

Electrochemical Society
4 Conference Proceedings Fabrication Of Air-Gaps Between Cu Interconnects For Low Intralevel k

Bhusari, D.M., Wedlake, M.D., Kohl, P.A., Case, C., Klements, F.P., Miner, J., Lee, B., Gutmann, R.J., Lee, J.J., Shick, …

Materials Research Society
10 Conference Proceedings Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSI

Lee, C. H., Fejes, P. L., York, B. R., Elwell, S. A., Carnes, R. O., Lee, J. Y., Grivna, G. M., Bauguess, S. W., Dreyer, …

MRS - Materials Research Society
5 Conference Proceedings Improvement of Planarization Efficiency of Cu Electropolishing By Additives

Chang, S-C., Shieh, J-M., Dai, B-T., Feng, M-S., Li., Y-H., Wang, Y-L.

Electrochemical Society
11 Conference Proceedings Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

J.S. Shin, H.K. Moon, B.H. Kim, H.S. Lee, H.C. Kwon

Trans Tech Publications
6 Conference Proceedings Novel two-step Al CMP process for overcoming pattern geometry effects

Tsai,M.-S., Lin,J.-S., Dai,B.-T.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings High performances of InGaP/GaAs MSM photodetectors using Cu/Au Schottky contact

Tsai,C.-D., Lin,Y.-J., Liu,D.-S., Lee,C.-T.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12