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Surface Characterization of Polyurethane Pads Used in Chemical Mechanical Polishing (CMP)

Author(s):
Ramsdell, J.
Seal, S.
Li, I.
Richardson, K.A.
Desai, V.
Easter, W.G.
1 more
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-26
Pub. Year:
2000
Page(from):
102
Page(to):
113
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772938 [1566772931]
Language:
English
Call no.:
E23400/200026
Type:
Conference Proceedings

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