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CVD Tungsten Via Void Minimization for Sub 0.25 μm Technology

Author(s):
Publication title:
CVD XV, proceedings of the fifteenth International Symposium on Chemical Vapor Deposition
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-13
Pub. Year:
2000
Page(from):
546
Page(to):
562
Pages:
17
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772785 [1566772788]
Language:
English
Call no.:
E23400/200013
Type:
Conference Proceedings

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