Chemical Mechanical Polishing with Selective Slurries

Chemical Mechanical Polishing with Selective Slurries

Author(s):: Oliver, Michael R.
Publication title:: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium
Title of ser.:: Electrochemical Society Proceedings Series
Ser. no.:: 99-37
Pub. Year:: 1999
Page(from):: 363
Page(to):: 368
Pages:: 6
Pub. info.:: Pennington, N. J.: Electrochemical Society
ISSN:: 01616374
ISBN:: 9781566772600 [1566772605]
Language:: English
Call no.:: E23400/99-37
Type:: Conference Proceedings

Details

TDL ID:	ZA00013965
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society ; Fall Meeting of the Electrochamical Society of Japan
Conf. info. (Number):	3rd ; 196th ; 1999
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	1999.10.20-1999.10.22

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